引线框架
材料科学
热导率
导电体
半导体
复合材料
合金
铜
极限抗拉强度
发光二极管
冶金
光电子学
半导体器件
图层(电子)
作者
Chang-Hun Lee,Ki-Chul Kim,Young-Sung Kim
出处
期刊:Journal of welding and joining (Online)
[The Korean Welding and Joining Society]
日期:2012-06-30
卷期号:30 (3): 32-37
被引量:4
标识
DOI:10.5781/kwjs.2012.30.3.230
摘要
Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.
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