材料科学
复合材料
超声波传感器
振动
激光器
声学
光学
物理
作者
Peicheng Peng,Daohui Xiang,Yanqin Li,Zhaojie Yuan,Xiaofei Lei,Bo Li,Gaofeng Liu,Bo Zhao,Guofu Gao
标识
DOI:10.1016/j.ceramint.2022.07.298
摘要
SiC p /Al composites are more and more used in aerospace, military industry and other industries. However, the surface integrity of materials is poor, and the cutting force is large as the anisotropy of materials in the traditional machining (TM) process, which hinders the application of ceramic particle reinforced metal matrix composites. With the requirement of high dimensional accuracy, high efficiency and low damage for materials in these fields, non-traditional machining technology has become a research hotspot. Laser assisted machining (LAM) is a non-contact special machining method. Its advantages in machining SiC p /Al composites have been proved by experiments, but there are still processing defects such as thermal cracks. Therefore, to further improve the machining quality of 70% SiC p /Al composites with high volume fraction, a new machining method combining ultrasonic elliptical vibration turning (UEVT) and laser heating assisted turning (LAT) is proposed. High frequency intermittent machining and the adjustment of laser temperature influence on materials can be realized by adjusting the ultrasonic amplitude. Combining the characteristics of the two processing techniques, the feasibility study of the new machining method was studied by turning experiments. In this paper, compared with TM and LAT, the removal mechanism of materials and the effects of different laser heating temperatures and ultrasonic vibration on cutting force, surface quality, subsurface damage and chip morphology are explored. The results show that LA-UEVT can effectively reduce the cutting force and surface roughness, improve the plastic removal ability, and inhibit surface and subsurface damage. And the material removal process is mainly in the form of small particle crushing and particle pressing, which improves the stability of cutting force in the cutting process.
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