A laser grooving protective material for chip ablation cutting

As the feature size of integrated circuits continues to shrink, the Cu-Low-k process is widely used, and wafers with Low-k films need to be processed by laser grooving. At the same time continuous expansion of the high-brightness LED market, improving product productivity, efficiency and yield has become the primary issue at present; in the process of many small chips, diamond dicing blades are generally used, and the high-speed rotating tool is used to rotate to drive. The blade set on the cutter performs the cutting action on the cut chip to realize the separation action; when cutting some high-hardness chips, the laser must be used to cut the groove first. The laser ablation process takes into account the efficiency, pass rate and cost. At the same time, as the feature size of semiconductor integrated circuits continues to shrink, in the process of separation, it is easy to leave impurities such as wax layer, dirt and circuit oxidation residues on the chip surface. The residual impurities contain active oxidation components, and the active oxidation the components are attached to the surface of the chip for a long time, which is easy to oxidize some substances on the surface of the chip, and may even drive the edge of the chip to produce edge chipping under the action of the gravity of dirt and impurities. LGP series water-soluble laser cutting protective liquid, used in semiconductor Low-k and LED laser ablation processing, can effectively inhibit the adhesion of LED chips and wafer surface debris, and has excellent cooling effect, prevent the thermal fixation of the protective film, to achieve cutting protection of sapphire, GaAs, Si and SiC substrates. It is also easy to cleaning, the chip surface can be cleaned with only water.