Enhancing Mechanical Reliability of Silver Sintered Joints With Copper Nanowires in High-Power Electronic Devices

Abstract This study investigated the mechanical reliability of silver-sintered die attachment under harsh operating conditions, and explored the advantages of adding copper nanowires to improve the bond’s mechanical properties. Samples were prepared using a template-assisted electrochemical deposition process to coat the substrate surface with copper nanowires, and were subjected to thermal aging at various temperatures to assess their mechanical reliability. Results showed that the incorporation of copper nanowires in the substrate interface significantly reduced degradation in shear strength as a result of thermal aging, acting as mechanical reinforcement and improving the interfacial resilience against mechanical shear stress. The addition of copper nanowires also reduced the void formation in the thermal aging, resulting in a more robust and reliable bond. The study demonstrates the potential of using copper nanowires as a reinforcing agent to enhance the mechanical properties of silver-sintered die attachment, particularly for high-temperature applications.