光学
薄脆饼
材料科学
激光器
硅
纳秒
胶粘剂
薄膜
基质(水族馆)
光电子学
复合材料
纳米技术
物理
海洋学
地质学
图层(电子)
作者
S. Wang,Yang Yu,Song Li,Ye Feng,Jinhui Li,Chunlei Yang,Weimin Li
出处
期刊:Applied Optics
[The Optical Society]
日期:2023-07-24
卷期号:62 (23): 6140-6140
被引量:1
摘要
Laser debonding offers several advantages such as precision, speed, minimal damage, and being noncontact. We investigated the feasibility of utilizing laser processing technology in producing high-performance ultra-thin wafer devices at a low cost. We successfully utilized the 355 nm ultraviolet nanosecond laser to develop a compatible laser debonding process for domestic temporary bonding adhesives, which effectively performed the laser lift-off of 8-in (20.3 cm) silicon/temporary bonding adhesive/glass substrate samples at a power density of 250mJ/cm2. We designed and developed a line light source shaping system that was ultimately able to produce a line spot with a length exceeding 1 cm and an energy distribution unevenness of less than 10%.
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