Flexible zinc-ion hybrid micro-supercapacitors with polymeric current collector for integrated energy storage in wearable devices

超级电容器 储能 电流(流体) 可穿戴计算机 集电器 材料科学 纳米技术 离子 电气工程 计算机科学 工程类 嵌入式系统 化学 电极 电化学 冶金 电解质 物理 有机化学 功率(物理) 物理化学 量子力学
作者
Louis Vaught,Ronald Sellers,Behrooz Shirani Bidabadi,Andreas A. Polycarpou,Ahmad Amiri
出处
期刊:Chemical Engineering Journal [Elsevier]
卷期号:492: 152234-152234 被引量:2
标识
DOI:10.1016/j.cej.2024.152234
摘要

The ubiquity of conventional micro-fabrication techniques has encountered impediments in constructing cost-effective micro-devices, thereby constraining their broad deployment. Concurrently, the suboptimal energy density inherent to supercapacitors exacerbates this challenge. This study presents a straightforward assembly methodology for the fabrication of a mechano-electrochemically-efficient micro-zinc ion hybrid supercapacitor (M−ZSC), alongside the introduction of an innovative polymeric current collector. The M−ZSC is fabricated through a process involving masked spray deposition of a novel adhesive current collector and the electrode materials, and electroplating of zinc nanosheets onto the anode finger, creating an electrochemically performant and mechanically robust device. The resulting M−ZSC exhibits a notable areal capacitance of 52.2 mF/cm2 and an energy density of 18.5 µWh/cm2 for the normal mass-loading of 3.6 mg/cm2, which is amongst the highest reported values for energy storage. The masked spray deposition/hot pressing technique enabled us to fabricate free-standing thick electrodes with a loading density of up to 56.1 mg/cm2, facilitating the achievement of an ultrahigh areal capacitance of 227 mF/cm2 and an energy density of 80.5 µWh/cm2. Furthermore, the M−ZSC exhibits a robust retention of 95 % capacitance at 1 mA/cm2. Critical to its flexibility, the device is constructed using purely additive deposition methods on flexible substrates and is therefore well-tailored for deployment in flexible electronics and on-chip applications. These micro-devices are well-poised for seamless integration within a singular electronics package or chip architecture.
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