已入深夜,您辛苦了!由于当前在线用户较少,发布求助请尽量完整地填写文献信息,科研通机器人24小时在线,伴您度过漫漫科研夜!祝你早点完成任务,早点休息,好梦!

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

电容 反射计 通过硅通孔 带宽(计算) 电感 等效电路 电子工程 计算机科学 集成电路 材料科学 时域 电气工程 光电子学 工程类 电压 物理 电信 电极 计算机视觉 量子力学
作者
D. Jung,Youngwoo Kim,Jonghoon J. Kim,Heegon Kim,Sumin Choi,Yinglin Song,Hae-Young Bae,Kwang‐Seong Choi,Stefano Piersanti,Francesco de Paulis,Antonio Orlandi,Joungho Kim
出处
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology [Institute of Electrical and Electronics Engineers]
卷期号:7 (1): 138-152 被引量:43
标识
DOI:10.1109/tcpmt.2016.2631731
摘要

Through silicon via (TSV)-based 3-D integrated circuit has introduced the solution to limitlessly growing demand on high system bandwidth, low power consumption, and small form factor of electronic devices. As the system design aims for higher performance, the physical dimensions of the channels are continuously decreasing. With TSV diameter of less than 10 μm and pitch of several tens of micrometers, the I/O count has increased up to the order of tens of thousands for wide bandwidth data transmission. However, without highly precise fabrication process, such small structures are susceptible to a variety of defects. For the first time, in this paper, we propose a noninvasive defect analysis method for high-speed TSV channel. With designed and fabricated test vehicles, the proposed method is demonstrated with S-parameter and time-domain reflectometry measurement results. In addition, we present equivalent circuit models of TSV daisy-chain structures, including the circuit components for open defect and short defect. With characterized dominant factors in each frequency range, S 11 is analyzed to distinguish and locate the defects by the amount of capacitance, resistance, and inductance that the signal experiences. S-parameter measurement sufficiently allows high-frequency defect analysis of TSV channel without destroying the test sample. We experimentally verified the accuracy of the suggested model by comparing the S-parameter results from circuit simulations and measurements. Finally, the model is modified to discuss the effects of open defect and short defect on the electrical characteristics of TSV channel.

科研通智能强力驱动
Strongly Powered by AbleSci AI
更新
PDF的下载单位、IP信息已删除 (2025-6-4)

科研通是完全免费的文献互助平台,具备全网最快的应助速度,最高的求助完成率。 对每一个文献求助,科研通都将尽心尽力,给求助人一个满意的交代。
实时播报
1秒前
3秒前
漂亮白枫发布了新的文献求助10
6秒前
Hello应助小药同学采纳,获得10
7秒前
7秒前
8秒前
victoria发布了新的文献求助10
8秒前
王半书发布了新的文献求助10
8秒前
10秒前
小秦秦完成签到 ,获得积分10
10秒前
orixero应助Lulu采纳,获得10
10秒前
哲别发布了新的文献求助10
11秒前
高大的友梅完成签到 ,获得积分10
11秒前
zzzxxxxxyyyyy发布了新的文献求助10
12秒前
doocan完成签到,获得积分10
12秒前
ppg123应助西瓜二郎采纳,获得10
12秒前
momo发布了新的文献求助10
12秒前
隐形曼青应助漂亮白枫采纳,获得10
13秒前
务实觅松完成签到 ,获得积分10
14秒前
coolkid应助负责怀莲采纳,获得10
14秒前
15秒前
YYYZZX1发布了新的文献求助10
15秒前
自由的聋五完成签到,获得积分10
15秒前
木槿花难开完成签到,获得积分10
15秒前
Del完成签到,获得积分10
19秒前
CNX发布了新的文献求助10
20秒前
范范778完成签到 ,获得积分10
20秒前
852应助YYYZZX1采纳,获得10
20秒前
20秒前
不羁完成签到 ,获得积分10
20秒前
21秒前
科研通AI2S应助希特勒采纳,获得10
22秒前
Del发布了新的文献求助10
23秒前
笑笑完成签到 ,获得积分10
23秒前
飞快的老太完成签到,获得积分10
24秒前
25秒前
Hello应助哲别采纳,获得10
25秒前
26秒前
26秒前
打打应助xxxrass采纳,获得10
28秒前
高分求助中
A new approach to the extrapolation of accelerated life test data 1000
ACSM’s Guidelines for Exercise Testing and Prescription, 12th edition 500
‘Unruly’ Children: Historical Fieldnotes and Learning Morality in a Taiwan Village (New Departures in Anthropology) 400
Indomethacinのヒトにおける経皮吸収 400
Phylogenetic study of the order Polydesmida (Myriapoda: Diplopoda) 370
基于可调谐半导体激光吸收光谱技术泄漏气体检测系统的研究 350
Robot-supported joining of reinforcement textiles with one-sided sewing heads 320
热门求助领域 (近24小时)
化学 材料科学 医学 生物 工程类 有机化学 生物化学 物理 内科学 纳米技术 计算机科学 化学工程 复合材料 遗传学 基因 物理化学 催化作用 冶金 细胞生物学 免疫学
热门帖子
关注 科研通微信公众号,转发送积分 3989832
求助须知:如何正确求助?哪些是违规求助? 3531967
关于积分的说明 11255613
捐赠科研通 3270725
什么是DOI,文献DOI怎么找? 1805035
邀请新用户注册赠送积分活动 882181
科研通“疑难数据库(出版商)”最低求助积分说明 809208