碳化硅
材料科学
研磨
陶瓷基复合材料
陶瓷
复合材料
复合数
激光器
辐射
散射
梁(结构)
灵敏度(控制系统)
机械加工
光学
光电子学
冶金
电子工程
物理
工程类
作者
Jingfei Yin,Jiuhua Xu,Wenfeng Ding,Honghua Su
标识
DOI:10.1016/j.compstruct.2022.115660
摘要
Given the urgent demand in the effective method for detecting the machining-induced damage (MID) of ceramic matrix composite (CMC). This study first time proposes the polarized laser scattering (PLS) method to detect the grinding-induced damage of silicon carbide fiber reinforced silicon carbide (SiCf/SiC). The feasibility of the PLS detection is demonstrated. Moreover, the sensitivity of PLS detection is found dependent on the radiation spot size of the laser beam. Decreasing the radiation spot size, the sensitivity to MID increases. However, the sensitivity to the pre-existed defects also increases, which would disturb the detection of MID. While increasing the radiation spot size, the intensity of the PLS detection decreases. In this study, when the radiation spot size is 66, 132, or 264 μm, the PLS method is suitable for detecting the grinding-induced damage of SiCf/SiC. This study is important for expanding the detection of the MID of CMC.
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