Fused Silica Dual-Shell Gyroscope with In-Plane Actuation by Out-Of-Plane Electrodes Realized Using Glassblowing and Thru-Glass-Vias Fabrication

This paper introduces a 3D Fused Silica (FS) dual-shell gyroscope (DSG) integrated with a planar electrode substrate, making the entire process compatible with a wafer-level fabrication. Utilizing a thru-glass-vias (TGV) technology, the fabricated out-of-plane electrode substrate supports DSG in-plane actuation, detection, and electrostatic compensation of the n = 2 mode, the n = 3 mode, as well as the synchronous operation of the two modes. A tuning algorithm was developed for all supported operational modalities. Gyroscope operations were demonstrated for the first time using the n = 2 and the n = 3 modes asynchronously, revealing Angle Random Walks of 0.03 and 0.083 deg/rt-hr and in run bias instabilities of 0.4 and 0.75 deg/hr.