聚酰亚胺
材料科学
数码产品
复合材料
工程物理
光电子学
电气工程
工程类
图层(电子)
作者
Aristide Gumyusenge,Xuyi Luo,Zhifan Ke,Dung T. Tran,Jianguo Mei
出处
期刊:ACS materials letters
[American Chemical Society]
日期:2019-06-07
卷期号:1 (1): 154-157
被引量:27
标识
DOI:10.1021/acsmaterialslett.9b00120
摘要
All-plastic transistor devices with thermal stability up to 220 °C are demonstrated. We employ polyimide substrates, polyimide dielectrics, and a polyimide-based semiconducting blend to achieve flexible and thermally-robust transistors. An in situ temperature-dependent charge transport study was used to demonstrate that these devices can operate in extremely high temperatures and can sustain prolonged baking. Our devices maintained stable charge-transport characteristics with charge mobilities of 0.20 cm2/(V s), ION/IOFF of 104, threshold voltage of 3 V, and operational voltage of 10 V when baked at 195 °C for 2 h.
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