Boric Acid as a Coupling Agent for Preparation of Phenolic Resin Containing Boron and Silicon with Enhanced Char Yield

In this study, an innovative, facile, and low-cost method is developed to prepare phenolic resin (PR) containing boron and silicon (BSiPR). BSiPR is synthesized by a solvent-free, one-pot method using boric acid as the coupling agent instead of silane, and methyltriethoxysilane as the silicon source. The results show that boron and silicon elements are introduced into PR via BOC and BOSi structures. The char yield of the resulting resin at 800 °C is improved to 76%. The reasons for higher char yield are investigated. The formation of BOC can reduce the content of phenolic hydroxyl, which helps to decrease the weight loss. B2 O3 is also formed at 400 °C, and it can prevent the release of carbon oxides. Moreover, thermally stable BOSi and SiO structures remain stable during the pyrolysis. In addition, the mechanical and ablative properties of fiber-reinforced composites are also enhanced.