Metalized Polyimide Fibrous Film via Metal—Organic Decomposition Method for Electromagnetic Interference (EMI) Shielding

With the development of highly integrated and miniaturized electronic devices, there is an urgent need for lightweight electromagnetic interference (EMI) shielding materials for a new generation of intelligent electronic devices. The traditional metallization processes are highly polluting and costly, so it is necessary to investigate new metallization methods to fabricate lightweight EMI shielding materials. In this study, silver was deposited on flexible polyimide (PI) fiber film using the metal-organic decomposition (MOD) method for EMI shielding. The effects of the metallization process on EMI shielding and mechanical properties of PI films were systematically studied. The results show that the fibrous PI film metalized by the MOD method has excellent EMI shielding performance and mechanical properties, especially, since its EMI shielding performance can reach 65 dB after heat treatment. After several bending tests, it still maintains good EMI shielding performance. Therefore, we believe that the lightweight electromagnetic shielding material prepared by this method has significant potential for the development of intelligent electronic devices.