材料科学
小型化
透射率
接触角
纳米技术
光电子学
水蒸气
纳米
薄膜
封装(网络)
柔性电子器件
聚对苯二甲酸乙二醇酯
湿度
半导体
化学工程
复合材料
物理
工程类
热力学
气象学
计算机科学
计算机网络
作者
Chao Li,Shizhong Yue,Tian Wu,Yumin Ye,Jun Li,Yongshun Huang,Zhangyi Huang,Yunying Wu,Jiaqian Sun,Zeren Zhao,Keqian Dong,Ling‐Bin Kong,Zhijie Wang,Shengchun Qu
标识
DOI:10.1002/admi.202300172
摘要
Abstract With the development of optoelectronic devices toward miniaturization, flexibility, and large‐scale integration, conventional submillimeter rigid encapsulation techniques rarely achieve conformational functionality while blocking water and oxygen. At the same time, the sensitivity of electronic devices with organic/metal/semiconductor components to humidity and oxygen severely impairs their operational stability and lifetime. Here, a nanometer to micrometer scale organic/inorganic hybrid thin film encapsulation (TFE) with the self‐cleaning ability for flexible encapsulation is developed. The water vapor transmittance rate of polyethylene terephthalate substrate coated with the TFE is as low as 1.65 × 10 −4 g m −2 day −1 , and the barrier improvement factor reaches 10 4 at 38 °C and 90% relative humidity. This value is equivalent to 9.81 × 10 −6 g m −2 day −1 at ambient conditions, sufficient to improve the lifetime of water‐sensitive electronic devices. Meanwhile, this TFE shows a super‐hydrophobic performance, with a water contact angle of 168.4°. In addition, the resulting barrier films exhibit outstanding optical properties, with an average optical transmittance of 86.88% in the visible region. This versatile TFE can promote the development of optoelectronic devices toward miniaturization and large‐scale integration in the future.
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