Development of a Novel Processing Route for Dispersoid/Precipitation‐Strengthened High Conductive Copper Alloys by Using Metalized Nanoceramics in Additive Manufacturing

材料科学 冶金 导电体 降水 复合材料 物理 气象学
作者
Heinrich von Lintel,Abdel-Rahman El-Sayed,Lukas Mielewczyk,Katja Eichmann,Julia Grothe,Ulrich Krupp,Avinash Hariharan,Katrin Jahns
出处
期刊:Advanced Engineering Materials [Wiley]
被引量:2
标识
DOI:10.1002/adem.202401957
摘要

The growing efficiency demands in aerospace components, such as heat exchangers, require the production of more and more complex copper parts that offer both high strength and electrical conductivity. The CuCrZr alloy, widely used in this field, can be further enhanced by incorporating ceramic nanoparticles to increase strength with minimal impact on conductivity. Powders‐based additive manufacturing using laser (PBF‐LB/M), provides the flexibility to produce customized 3D components while enabling versatile alloy designs. A key challenge in manufacturing oxide‐dispersion‐strengthened copper alloys (Cu‐ODS) is the availability of appropriate powder feedstock. This study examines a process chain to produce dispersoid‐strengthened CuCr1Zr using in situ alloying with metalized nanoceramics. CuCr1Zr powder is created through gas atomization, while copper‐plated alumina (Cu‐Al 2 O 3 ) nanoparticles are prepared using an organic surface activation method. Additive manufacturing is then conducted using green and red laser systems via PBF‐LB/M, followed by heat treatment at 480 °C for 2 h. The results show excellent densification and surface quality in printed samples, both with and without nanoparticle reinforcement. Additionally, it is found that lower levels of organic activation improve the relative density of the printed components, underscoring the need to optimize this process step for enhanced material properties.
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