材料科学
氮化硼
复合材料
聚四氟乙烯
热导率
金属
硼
氮化物
热的
冶金
化学
物理
有机化学
图层(电子)
气象学
作者
Rui Xue,Zilong Xie,Songgang Chai,Tianhao Yang,Rui Feng,Lu He,Kai Wu,Qin Zhang,Qiang Fu
标识
DOI:10.1016/j.compscitech.2024.110572
摘要
Polytetrafluoroethylene (PTFE)/boron nitride (BN) composites has ultra-low dielectric loss and thermal conductivity, making it a suitable choice for high-frequency communication copper-clad laminate. However, the low peel strengthens of these composites restricted the further application, due to the low polarity and smooth surface of BN. Here, we assemble liquid metal (LM) on BN filler (LM-BN) via a mechanochemistry method. The surface polarity and roughness of BN can be enhanced by the oxidized layer from LM. The thermal interfacial overlap between BN sheets can be enhanced by LM droplets. Consequently, at filler content of 50 vol%, the thermal conductivity increases from 0.3 W/m⋅K of PTFE to 1.90 W/m⋅K for PTFE/BN composites, to 2.05 W/m⋅K for PTFE/LM-BN composites, and the peel strength exhibit a nearly 100% increment from 0.19 of PTFE/BN to 0.39 N/mm of PTFE/LM-BN. Along with low dielectric loss, excellent thermal conductivity, peel strength, and reduced thermal expansion, this method ensures a wider application of PTFE/LM-BN composites in electronic packaging.
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