光致聚合物
聚电解质
材料科学
电介质
介电强度
复合材料
高分子科学
高分子化学
聚合物
聚合
光电子学
作者
Ethan T. Iverson,Hudson Legendre,Jason P. Killgore,Jaime C. Grunlan,Thomas J. Kolibaba
标识
DOI:10.1021/acsmacrolett.4c00456
摘要
Polymer-based dielectrics are struggling to keep pace with the increasing demands of modern electronics. This lag in dielectric performance has spurred significant interest in the production of advanced dielectrics via novel chemistries and processing techniques. Polyelectrolyte complexes (PECs) have recently shown great promise as dielectric insulation, but processing challenges presented by these ionically bound networks limit their use to conformal thin films. Recent advances have enabled the additive manufacturing of PECs with vat photopolymerization, allowing the creation of a polyelectrolyte complex of arbitrary shape. Herein, multiple polyelectrolyte resin formulations, comprised of polyethylenimine and methacrylic acid (with varying amounts of 2-hydroxyethyl methacrylate and/or
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