材料科学
极限抗拉强度
烧结
扫描电子显微镜
粉末冶金
复合材料
电阻率和电导率
维氏硬度试验
复合数
相对密度
压痕硬度
微观结构
色散(光学)
电气工程
光学
物理
工程类
作者
Nalin Somani,Yogita Tyagi,Nitin Kumar Gupta
出处
期刊:Journal of Engineering, Design and Technology
[Emerald (MCB UP)]
日期:2021-12-28
卷期号:22 (1): 77-88
被引量:10
标识
DOI:10.1108/jedt-07-2021-0374
摘要
Purpose The purpose of this study is to investigate the effect of the sintering temperature on the microstructural, mechanical and physical properties of Cu-SiC composites. Design/methodology/approach The powder metallurgy route was used to fabricate the samples. Cold compaction of powders was conducted at 250 MPa which was followed by sintering at 850°C–950°C at the interval of 50 °C in the open atmospheric furnace. SiC was used as a reinforcement and the volumetric fraction of the SiC was varied as 10%, 15% and 20%. The processed samples were metallurgically characterized by the scanning electron microscope (SEM). Mechanical characterization was done using tensile and Vickers’ micro-hardness testing to check the hardness and strength of the samples. Archimedes principle and Four-point collinear probe method were used to measure the density and electrical resistivity of the samples. Findings SEM micrograph reveals the uniform dispersion of the SiC particles in the Cu matrix element. The results revealed that the Hardness and tensile strength were improved due to the addition of SiC and were maximum for the samples sintered at 950 °C. The addition of SiC has also increased the electrical resistivity of the Cu-SiC composite and was lowest for Cu 100% while the relative density has shown the reverse trend. Further, it was found that the maximum hardness of 91.67 Hv and ultimate tensile strength of 312.93 MPa were found for Cu-20% SiC composite and the lowest electrical resistivity of 2.017 µ- Ω-cm was found for pure Cu sample sintered at 950 °C, and this temperature was concluded as the optimum sintering temperature. Research limitations/implications The powder metallurgy route for the fabrication of the composites is a challenging task as the trapping of oxygen cannot be controlled during the compaction process as well as during the sintering process. So, a more intensive study is required to overcome these kinds of limitations. Originality/value As of the author’s best knowledge, no work has been reported on the effect of sintering temperature on the properties of the Cu-SiC composites which has huge potential in the industries.
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