Synthesis of ultraviolet curable bisphenol‐based epoxy acrylates and comparative study on its physico‐chemical properties

Abstract Photocuring resins have emerged as cutting‐edge technology in coatings, adhesives, composites, additive manufacturing, and so forth. In the present work, different bisphenol, namely A, F, and S, were used to synthesize low molecular weight epoxy resin, which was further reacted with acrylic acid monomer to form bisphenol‐based epoxy acrylate (BEA). The BEA resins were formulated using reactive diluents, trimethylolpropane triacrylate, and hexanediol diacrylate in the ratio of 0–40 wt% at the increment of 10 wt% alongside a fixed quantity photoinitiator. These resins were then cast into dumbbell‐shaped specimens by irradiating them under ultraviolet (UV) light. The structural elucidation of BEA resins was performed using Fourier transform infrared, nuclear magnetic resonance, and UV–Vis spectroscopy. The formulated resins were also studied for their rheological properties. Further, the UV cured specimens were evaluated for mechanical, thermal, contact angle, and extent of curing. These outcomes were utilized for establishing the structure–property relationship based on the functionality, reactivity, and molecular structure of synthesized BEA resins, which controllers the design architecture and cross‐linking density of UV‐cured specimens.