Mechanical properties and oxidation resistance of Sn-Zn-xCu (2.3 ≤ x ≤ 20.2) solder alloys prepared by high-throughput strategy

Sn-Zn-Cu solder alloys are predominantly developed through a sequential and time-consuming trial-and-error approach. Here, it is presented that Cu-doped Sn-Zn-based solder alloy thin films can be fabricated by high-throughput strategy. The influence of Cu content on the phase constitution, mechanical properties and oxidation resistance of the Sn-Zn-Cu thin films was investigated in detail. The highest Young’s modulus of the film can be obtained with the addition of 2.3 wt% Cu. Superior oxidation resistance is expected to be acquired with low Cu content. Our results demonstrate that the combination of multiple target co-sputtering deposition is an effective way for rapidly developing lead-free solder.