Influence of diamond content and milling duration on microstructure and thermal conductivity of Ti-coated diamond/copper composite coating on copper substrate

Abstract In the present work, Ti-coated diamond/copper composite coatings were effectively deposited on T2 Cu matrix via mechanical alloying method. Influences of diamond content and milling time upon the coatings were studied. The results stated that it could promote the wettability between copper and diamond through diamond surface modification with Ti powder by mechanical alloying. It was also a pre-refinement process of diamond particles, which was beneficial to obtain coatings with uniform diamond distributions and promoted properties. Coatings with excellent microstructures and mechanical properties were obtained with the diamond volume fraction of 40% and the milling time of 7 h. Heat treatment was greatly significant to the thermal performance. And the sample was exhibited excellent thermal conductivity of 409W/mK after annealing at 800 °C for 1 h.