Advanced solutions for ultra-thin wafers and packaging

DISCO Corporation is a leading manufacturer for equipment and tools for wafer thinning and dicing. “Bringing science to comfortable living by Kiru (Dicing), Kezuru (Grinding) and Migaku (Polishing)” is DISCO's mission. By combining these three core technologies, DISCO provides total solutions to meet the more and more demanding requirements of the Semiconductor industry in terms of manufacturing thin dies with high die-strengths and several new approaches for advanced packaging. When developing such processes, circumstances for the total process flow from front-end to packaging are actively taken into consideration. This article describes various process flows which on the one hand are implemented in the industry as state of the art processes (Conventional process, DBG), but on the other hand also processes which are considered for the future to meet the upcoming requirements for the packaging industry, such as TSV (Through Silicon Via) for die-stacking, thin power devices and the combination of MEMS- and logic devices in one package.