Polyamide-formaldehyde resin as a low-toxic adhesive for wood bonding

二乙烯三胺 材料科学 胶粘剂 脲醛 聚脲 复合材料 聚酰胺 甲醛 胺气处理 高分子化学 有机化学 化学 图层(电子) 涂层
作者
Mengdie Su,Jinfu Wu,Peidi Pan,Haijun Wang
出处
期刊:Journal of Adhesion Science and Technology [Taylor & Francis]
卷期号:36 (18): 1964-1977
标识
DOI:10.1080/01694243.2021.1994757
摘要

Formaldehyde-based resins are widely used in the field of wood adhesives. However, high formaldehyde emission is still a serious problem. Therefore, a low-toxic wood adhesive was successfully synthesized using branched polyamide and formaldehyde via hydroxymethylation in this work. The polyamide was firstly synthesized by condensation between diethylenetriamine (DETA) and urea (U), with no solvents and catalysts used, which also avoided purification. Then the polyamide directly reacted with formaldehyde with different F/U molar ratios to obtain polyamide-formaldehyde resins. The characterization results show that the polyamide contains terminal amine and urea groups, and the formaldehyde was basically reacted completely. The test results of adhesive performance show dry bonding strength of polyamide-formaldehyde resin (F/U = 2) reached 1.72 MPa and wet bonding strength was still greater than the standard requirements (≥0.7 MPa), but the formaldehyde emission was only 0.2 mg/L, which was well under the E0 standard (≤0.5 mg/L), indicating that adhesive resins introduced with stable polyurea linkages and branched cross-linked structure have great performance. Low-cost reactants, a simple preparation process, and great adhesive performance will increase the potential application of the resins in the field of the wood industry.
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