材料科学
印刷电子产品
数码产品
模板
柔性电子器件
丝网印刷
固化(化学)
电子包装
印刷电路板
复合材料
3d打印
三维打印
3D打印
纳米技术
光电子学
墨水池
电气工程
计算机科学
制造工程
计算科学
工程类
作者
Vitalij Scenev,Jerzy Szałapak,Lukas Werft,Ole Hoelck,Małgorzata Jakubowska,Malte von Krshiwoblozki,Christine Kallmayer,Martin Schuster
标识
DOI:10.1002/adem.202101752
摘要
Scalable additive manufacturing of printed electronics is a growing field accompanied by increasing demands for reliable and integrable functional flexible printed electronic devices. Herein, a novel type of electrically conducting silver‐based pastes for additive manufacturing is demonstrated. These pastes are designed for stencil‐ and screen‐printing and can be post‐processed at very low temperatures, at ambient. Furthermore, printed lines made with the pastes exhibit an electrical sheet resistance below 60 mΩ sq −1 even after room temperature and only 25 mΩ sq −1 after two minutes of curing at 90 °C.
科研通智能强力驱动
Strongly Powered by AbleSci AI