Ultra-thin wafer technology and applications: A review

Ultra-thin wafers with thickness of typically less than 200 μm are important building blocks in semiconductor device manufacturing. Due to the special mechanical properties of ultra-thin wafers, the fabrication and handling of ultra-thin wafers are substantially different from traditional ones. Thus, the progresses of ultra-thin wafer technology from manufacturing process to wafer transportation and device application are reviewed herein. The combination of mechanical grinding and stress relief through polishing or etching has become the standard wafer thinning process. Owing to the rising of TAIKO wafers, special equipments and carriers have the potential to be eliminated in ultra-thin wafer handling. Ultra-thin wafer has broad applications in semiconductor device fabrication and would have long-term impact on semiconductor industrial.