Electrically addressed focal stack plenoptic camera based on a liquid-crystal microlens array for all-in-focus imaging

微透镜 焦距 堆栈(抽象数据类型) 光学 光学(聚焦) 焦点 基点 景深 视野 计算机科学 材料科学 物理 镜头(地质) 程序设计语言
作者
Mingce Chen,Mao Ye,Zhe Wang,Cong Hu,Taige Liu,Kewei Liu,Shi Jin,Xinyu Zhang
出处
期刊:Optics Express [Optica Publishing Group]
卷期号:30 (19): 34938-34938 被引量:5
标识
DOI:10.1364/oe.465683
摘要

Focal stack cameras are capable of capturing a stack of images focused at different spatial distance, which can be further integrated to present a depth of field (DoF) effect beyond the range restriction of conventional camera's optics. To date, all of the proposed focal stack cameras are essentially 2D imaging architecture to shape 2D focal stacks with several selected focal lengths corresponding to limited objective distance range. In this paper, a new type of electrically addressed focal stack plenoptic camera (EAFSPC) based on a functional liquid-crystal microlens array for all-in-focus imaging is proposed. As a 3D focal stack camera, a sequence of raw light-field images can be rapidly manipulated through rapidly shaping a 3D focal stack. The electrically addressed focal stack strategy relies on the electric tuning of the focal length of the liquid-crystal microlens array by efficiently selecting or adjusting or jumping the signal voltage applied over the microlenses. An algorithm based on the Laplacian operator is utilized to composite the electrically addressed focal stack leading to raw light-field images with an extended DoF and then the all-in-focus refocused images. The proposed strategy does not require any macroscopic movement of the optical apparatus, so as to thoroughly avoid the registration of different image sequence. Experiments demonstrate that the DoF of the refocused images can be significantly extended into the entire tomography depth of the EAFSPC, which means a significant step for an all-in-focus imaging based on the electrically controlled 3D focal stack. Moreover, the proposed approach also establishes a high correlation between the voltage signal and the depth of in-focus plane, so as to construct a technical basis for a new type of 3D light-field imaging with an obvious intelligent feature.

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