材料科学
陶瓷
微观结构
热解
立体光刻
甲基丙烯酸酯
聚合物
复合材料
收缩率
热解炭
纳米颗粒
光刻胶
化学工程
表面改性
纳米技术
聚合
图层(电子)
工程类
作者
Tuan Anh Pham,D.‐P. Kim,Tae-Woo Lim,S.‐H. Park,Daejong Yang,K.‐S. Lee
标识
DOI:10.1002/adfm.200600009
摘要
Abstract We report a newly synthesized inorganic polymer photoresist with a high ceramic yield by the functionalization of polyvinylsilazane (KiON VL20) with 2‐isocyanatoethyl methacrylate via linkage or insertion reaction routes. The chemistry of the synthesis and the pyrolytic conversion as well as the mechanical evaluation were investigated by using various analytical instruments. We show for the first time that this photosensitive resin is a novel precursor for the fabrication of complex 3D SiCN ceramic microstructures with a 210 nm resolution via a two‐photon absorbed crosslinking process and subsequent pyrolysis at 600 °C under a nitrogen atmosphere. Moreover, the dimensional deformation during pyrolysis was significantly reduced by adding silica nanoparticles as a filler. In particular, the ceramic microstructures containing 40 wt % silica nanoparticles exhibited a relatively isotropic shrinkage owing to its sliding free from the substrate during pyrolysis.
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