蚀刻(微加工)
铜
材料科学
制作
冶金
热导率
各向同性腐蚀
数码产品
热的
电阻率和电导率
表面光洁度
复合材料
工程类
电气工程
病理
图层(电子)
替代医学
医学
物理
气象学
出处
期刊:Key Engineering Materials
日期:2007-12-01
卷期号:364-366: 460-465
被引量:29
标识
DOI:10.4028/www.scientific.net/kem.364-366.460
摘要
Wet etching processes have been widely used for producing micro-components for various applications. These processes are simple and easy to implement. The selection of suitable chemical solution which is called etchant is the most important factor in the wet etching processes. It affects etch rate and surface finish quality. Copper and its alloys are important commercial materials in various industries, especially in electronics industry. Their wide applications are due to their excellent electrical and thermal conductivity, ease of fabrication, good strength and fatigue properties. The present study examines the possible etchants for copper and its alloys and reviews studies in detail to find out optimum etchant and its application parameters. The study is also aimed to provide information about safety, health and environmental issues caused by using various etchants in wet etching processes of copper and copper alloys.
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