碳化硅
功率(物理)
功率半导体器件
材料科学
电源模块
电气工程
电力电子
作者
Takashi Nakamura,Yoshiaki Nakano,Masatoshi Aketa,Toshio Hanada
出处
期刊:Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE-ASIA), 2014 International
日期:2014-05-01
被引量:2
标识
DOI:10.1109/ipec.2014.6869873
摘要
Summary form only given. Silicon Carbide (SiC) devices have the potential to reduce energy losses in high power applications. However SiC devices have yet to achieve ideal performance levels. The SiC diodes and MOSFETs with advanced trench structures succeeded in improving performance by reduction of the internal electric field. In addition, transfer mold type power modules using SiC devices demonstrated high temperature operation and high power density.
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