Extrusion‐Based Additive Manufacturing Samples with Desirable Thermal Conductivities Prepared by Incorporating Hybrid Hexagonal Boron Nitride(h‐BN) and Novel Process Strategy

Abstract In this work, a high thermal conductivity (TC) sample is prepared by extrusion‐based additive manufacturing (AM). Polyurethane/polylactide (TPU/PLA) is chosen as the matrix material, and hexagonal boron nitride (h‐BN) acts as the filler. Although the loading of h‐BN is fixed at 30 wt%, the TC values can shift from 0.63 to 1.80 W m K, which shows the importance of processing control. The influences of filler size, filler system, and process strategy are discussed systematically. This work provides some new ideas in preparing high TC polymer composite. The sample can be potentially utilized at some conditions which need rapid prototyping, good thermal conductivity, and good ductility.