放大器
电子工程
线性
功率(物理)
热分析
温度测量
非线性系统
表征(材料科学)
计算机科学
电子线路
热的
材料科学
工程类
电气工程
CMOS芯片
物理
气象学
量子力学
纳米技术
作者
Parastoo Taghikhani,Koen Buisman,M. Versleijen,José-Ramón Pérez-Cisneros,Christian Fager
出处
期刊:IEEE Transactions on Microwave Theory and Techniques
日期:2022-02-01
卷期号:70 (2): 1349-1360
被引量:1
标识
DOI:10.1109/tmtt.2021.3134664
摘要
In this paper, we propose an efficient methodology for the electrothermal characterization of power amplifier (PA) integrated circuits.The proposed electrothermal analysis method predicts the effect of temperature variations on the key performances of PAs, such as gain and linearity, under realistic dynamic operating conditions.A comprehensive technique for identifying an equivalent compact thermal model, using data from 3-D finite element method thermal simulation and nonlinear curve fitting algorithms, is described.Two efficient methods for electrothermal analysis applying the developed compact thermal model are reported.The validity of the methods is evaluated using commercially available electrothermal computer-aided design (CAD) tools and through extensive pulsed RF signal measurements of a PA device under test.The measurement results confirm the validity of the proposed electrothermal analysis methods.The proposed methods show significantly faster simulation speed comparing to available CAD tools for electrothermal analysis.Moreover, the results reveal the importance of electrothermal characterization in the prediction of the temperature-aware PA dynamic operation.
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