Facile healing of cracks in organic–inorganic halide perovskite thin films

Abstract Organic–inorganic halide perovskite (OIHP) thin films at the heart of the burgeoning thin-film perovskite solar cells (PSCs) technology possess poor mechanical properties, which is likely to limit the long-term reliability of PSCs as they are poised for commercialization. In an effort to address this issue, here we demonstrate that through-thickness cracks induced by bending-tension in thin films of the two prototypical OIHPs, methylammonium lead triiodide (MAPbI3) and formamidinium lead triiodide (FAPbI3), can be healed easily. This is through the application of either a moderate compressive stress (bending-compression) at room temperature or a simple heat-treatment at modest temperatures. The crack-healing process is found to be time-dependent, which indicates that facile mass-transport in OIHPs plays a key role in this phenomenon. An explanation for this phenomenon is provided, one based on the fundamentals of brittle fracture. This discovery has broad implications for the prevention and/or restoration of the overall performance, environmental stability, and mechanical reliability of PSCs, and other devices.