A review of microstructure and texture evolution with nanoscale precipitates for copper alloys

Copper alloys are widely used in the lead frame, high-speed railway and other applications due to their high electrical conductivity and adequate mechanical properties. In this work, the texture and microstructure evolution under hot deformation of Cu-Ni-Si, Cu-Co-Si and Cu-Fe-P alloys were investigated. In order to analyze the texture evolution, the standard pole figures and ODF figures were established. The TEM analysis shows that the addition of trace elements promoted the dispersion of nanoscale precipitated phase particles in the matrix, which can hinder the movement of grain boundaries and dislocations. In addition, the suitable hot processing parameters for the Cu-Fe-P alloy were determined from the hot working diagram. Finally, the comprehensive diagrams for the effects of addition of the alloying elements on the electrical conductivity and ultimate tensile strength of the Cu-Ni-Si and Cu-Fe-P alloys were obtained.