无损检测
声学
超声波传感器
脱轨
磁道(磁盘驱动器)
超声波检测
窄带
工程类
激光器
有限元法
信号(编程语言)
结构工程
电子工程
计算机科学
机械工程
光学
医学
物理
放射科
程序设计语言
作者
Imran Ghafoor,Peter W. Tse,Taw Kuei Chan,Haibo Hu
出处
期刊:IEEE Transactions on Instrumentation and Measurement
[Institute of Electrical and Electronics Engineers]
日期:2024-01-01
卷期号:: 1-1
标识
DOI:10.1109/tim.2024.3350150
摘要
Rail flaws can be initiated either from manufacturing or service-related anomalies. These flaws may lead to train derailment while in service if not detected timely. Traditional Non-destructive testing (NDT) techniques are mainly contact-type and have low inspection speeds. Laser ultrasonic testing is an advanced NDT that provides non-contact, broadband and highly sensitive inspection. Meanwhile, Rayleigh waves suffer little attenuation during propagation and travel long distances on curved surfaces like rail. Therefore, this research proposes a design of a fully non-contact laser-based rail inspection system to detect surface and subsurface defects at different parts (head, web and foot) of the inspected rail track. The laser-based thermoelastic generation of narrowband Rayleigh waves were investigated using the finite element method (FEM). The experiments were performed on defective rail samples with artificial surface and circular subsurface defects in the inspected rail track. The time and frequency analyses of both simulation and experimental results show that the Line Arrayed Pattern (LAP) type of laser illumination is promising in generating narrowband Rayleigh waves that have great potential in detecting rail defects. In field measurements, finding the defect’s location is usually challenging because unwanted wave packets mostly surround defect echoes in a laser-generated ultrasonic signal. In this regard, a criterion named time-of-flight-based flaw detection (TOFFD) was proposed to identify defect echoes surrounded by high noise peaks automatically. TOFFD was successfully applied to laser-generated ultrasonic signals captured at the rail track to find the location of the flaw by identifying the defect echo.
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