材料科学
焊接
金属间化合物
等温过程
复合数
基质(水族馆)
润湿
复合材料
图层(电子)
合金
冶金
热力学
海洋学
物理
地质学
作者
Yihui Du,Yishu Wang,Xiaoliang Ji,Qiang Jia,Fu-Wen Zhang,Fu Guo
标识
DOI:10.1016/j.mtcomm.2022.103572
摘要
In this work, a novel composite solder was fabricated by mechanically incorporating Ni-coated carbon fiber (Ni-CF) into the Sn-3.5Ag solder paste in an effort to improve the overall service capability, where the intermetallic compound (IMC) formation and growth is a fundamental issue for consideration. General findings indicated that the addition of Ni-CF did not significantly impact the processing properties of the base alloy, such as melting temperature and wettability, when the reinforcement fraction was less than 2 wt%. Isothermal aging tests were carried out to study the formation and growth of interfacial IMC layers between the composite solder and Cu substrate. The addition of Ni-CF into Sn-3.5Ag solder could effectively promote the formation of interfacial (Cu, Ni)6Sn5 phase during reflow but retard its growth in the solid-state aging. The addition of 1 wt% Ni-CF was believed to be more effective to restrict and reduce the subsequent growth rate of the IMCs during solid-state aging due to the initial formation of a thicker (Cu, Ni)6Sn5 layer after reflow.
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