环氧树脂
胶粘剂
缩水甘油醚
复合材料
氢键
固化(化学)
材料科学
粘附
双酚A
化学
分子
有机化学
图层(电子)
作者
Shin Nakamura,Satoru Yamamoto,Yuta Tsuji,Keiji Tanaka,Kazunari Yoshizawa
出处
期刊:Langmuir
[American Chemical Society]
日期:2022-05-19
卷期号:38 (21): 6653-6664
被引量:26
标识
DOI:10.1021/acs.langmuir.2c00529
摘要
To ensure the quality and reliability of products bonded by epoxy resin adhesives, elucidation of the microscopic adhesion mechanism is essential. The adhesive interaction and bonding strength between epoxy resins and hydroxylated γ-alumina (001) surfaces were investigated by using a combined molecular dynamics (MD) and density functional theory (DFT) study. The curing reaction of an epoxy resin consisting of diglycidyl ether of bisphenol A (DGEBA) and 4,4'-diaminodiphenyl sulfone (DDS) was simulated. The resin structure was divided into fragmentary structures to study the interaction of each functional group with the alumina surface using DFT calculations. From the characteristics of the adhesive structures and the calculated adhesion energies, it was found that the fragments forming hydrogen bonds with hydroxy groups on the alumina surface resulted in large adhesion energies. On the other hand, the fragments adsorbed on the alumina surface via dispersion interactions resulted in small adhesion energies. The adhesion forces evaluated from the Hellmann-Feynman force calculations indicated the significant contribution of the hydroxy groups and benzene ether moieties derived from DGEBA to the adhesive stress of the DGEBA/DDS epoxy resin. The direction of hydrogen bonding between the epoxy resin and the surface and the difference in geometry at the interface between the donor and acceptor of hydrogen bonding played a central role in maintaining the adhesive strength during the failure process of the adhesive interface.
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