拓扑优化
消散
拓扑(电路)
灵敏度(控制系统)
差异(会计)
电子设备和系统的热管理
数学优化
数学
计算机科学
应用数学
结构工程
工程类
机械工程
物理
有限元法
热力学
电子工程
会计
业务
组合数学
作者
Jun Yan,Qi Xu,Zhirui Fan,Dongling Geng,Bin Niu,Zunyi Duan
标识
DOI:10.1080/0305215x.2022.2086236
摘要
This article investigates two different objective functions (minimizing heat dissipation weakness and temperature variance) to realize topology design optimization of heat dissipation problems based on the explicit topology optimization method of moving morphable components (MMC). The advantages of explicit and clear geometric profile descriptions in dealing with heat dissipation are explored. Sensitivity derivation with respect to the explicit topological geometric variables of the MMC-based method is established for two objective functions. Numerical examples are presented, with extensive discussion and comparisons of the key factors of maximum temperature gradient, temperature variance and maximum temperature based on the two objective functions. These discussions demonstrate the scope of application of the objective functions. Compared with density-based topology design optimization, the present MMC-based method describes the geometric profile of the heat dissipation structure accurately and achieves a more accurate and efficient heat dissipation performance of the structure.
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