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40 积分 2023-06-26 加入
Formation mechanism of subtrenches on cone-shaped patterned sapphire substrate
3天前
已完结
Vertical silicon nanowedge formation by repetitive dry and wet anisotropic etching combined with 3D self-aligned sidewall nanopatterning
14天前
已完结
TSV Integration With Chip Level TSV-to-Pad Cu/SiO₂ Hybrid Bonding for DRAM Multiple Layer Stacking
28天前
已完结
Reliability Characterization of HBM featuring $\text{HK}+\text{MG}$ Logic Chip with Multi-stacked DRAMs
1个月前
已完结
A study on D2W Hybrid Cu bonding Technology for HBM Multi-die Stacking
2个月前
已完结
Present and Future, Challenges of High Bandwith Memory (HBM)
2个月前
已完结
Investigation of Amorphous Silicon as Dry Etch Hard Mask in BEOL Low-k Dielectric Patterning
3个月前
已完结
DFT-1/2 and shell DFT-1/2 methods: electronic structure calculation for semiconductors at LDA complexity
8个月前
已完结
Structure design and properties investigation of Bi2O2Se/graphene van der Waals heterojunction from first-principles study
8个月前
已完结
First-principles study on GeC/β-AsP heterostructure with type-II band alignment for photocatalytic water splitting
8个月前
已完结
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