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66 积分 2023-04-06 加入
Joint‐Inspired Liquid and Thermal Conductive Interface for Designing Thermal Interface Materials with High Solid Filling yet Excellent Thixotropy
3天前
已完结
Mechanochemistry-mediated colloidal liquid metals for electronic device cooling at kilowatt levels
3天前
已完结
Strain-rate-dependent tensile response of an alumina ceramic: Experiments and modeling
15天前
已完结
Alkylated modified boron nitride nanosheets/polyimide composite films with advanced thermal conductivity and low dielectric constant
21天前
已完结
Processing, thermal conductivity and flame retardant properties of silicone rubber filled with different geometries of thermally conductive fillers: A comparative study
1个月前
已完结
Data-driven rheological characterization of stress buildup and relaxation in thermal greases
1个月前
已完结
Theoretical analysis on thermal grease dry-out degradation in space environment
1个月前
已完结
D−π−A Strategy to boost dielectric breakdown strength of polyimide insulation
1个月前
已完结
Highly thermally conductive and soft thermal interface materials based on vertically oriented boron nitride film
1个月前
已完结
Highly Thermally Conductive and Flexible Thermal Interface Materials with Aligned Graphene Lamella Frameworks
2个月前
已完结
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