Lv21
168 积分 2022-07-27 加入
Laser jet solder ball bonding of SAC305/Cu BGA joints: Microstructure, temperature field simulation and mechanical property
4个月前
已完结
A comparative study of laser soldering and reflow soldering using Sn–58Bi solder/Cu joints
4个月前
已完结
Essential Factors Influencing the Wettability of Sn-3.0 Ag-0.5 Cu Solder Balls on Au Pad of the Right-Angle Solder Interconnect in Laser Jet Solder Ball Bonding
4个月前
已完结
Effect of Cu Diffusion Through Ni on the Interfacial Reactions of Sn3.5Ag0.75Cu and SnPb Solders with Au/Ni/Cu Substrate during Aging
4个月前
已完结
Effect of In Addition on Microstructure, Wettability and Strength of SnCu Solder
4个月前
已完结
Effect of Au thin films thickness on the wetting characteristics of eutectic Pb-Sn solder on Ni/Ag solder bath
7个月前
已完结
Influence of Zn Coating on Interfacial Reactions and Mechanical Properties During Laser Welding-Brazing of Mg to Steel
8个月前
已完结
Reactive wetting of a metal/ceramic system
9个月前
已完结
Wetting behavior of eutectic Au–Sn solder on Ni/Au metallization at different temperatures
10个月前
已完结
Molecular dynamics simulation on wetting of silver nanosolder on a diamond surface
10个月前
已完结
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