Lv11
60 积分 2024-08-11 加入
A study of the residual stress behavior of rigid and flexible epoxy adhesives during thermal cycle aging for electronics packaging
1小时前
已完结
Present status and prospects of nano-silver particles in the electronic field: a review
1小时前
已完结
Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets
22天前
已完结
Machine learning approach for analysing and predicting the modulus response of the structural epoxy adhesive at elevated temperatures
30天前
已完结
Unlocking Self‐antioxidant Capability and Processability of Additive‐free MXene Ink towards High‐performance Customizable Supercapacitors
1个月前
已完结
Fabrication of MWCNT and phenolic epoxy resin reinforced PVDF: a composite with low dielectric loss and excellent mechanical properties
2个月前
已完结
Polyurethane modified epoxy vitrimer and its stress relaxation behavior
2个月前
已完结
High-speed and large-scale intrinsically stretchable integrated circuits
2个月前
已完结
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