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80 积分 2024-09-18 加入
Enhanced interface structure of electroformed copper/diamond composites for thermal management applications
58分钟前
待确认
Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interface
1小时前
已完结
Enhancing interfacial thermal transport efficiently in diamond/graphene heterostructure by involving vacancy defects
1小时前
已完结
Enhancing interfacial thermal transport efficiently in diamond/graphene heterostructure by involving vacancy defects
1小时前
已完结
Fabrication and heat dissipation performance of Diamond/Cu composite with diamond bars inserted in the normal direction
1小时前
已完结
Boosted the thermal conductivity of liquid metal via bridging diamond particles with graphite
13天前
已完结
A simple strategy towards construction of copper foam-based robust superhydrophobic coating based on perpendicular nanopins for long-lasting delayed icing and reduced frosting
1个月前
已完结
Coherent Interface Migration Toughens Diamond
1个月前
已完结
Room temperature optically detected magnetic resonance of single spins in GaN
1个月前
已完结
Structural transition and migration of incoherent twin boundary in diamond
1个月前
已完结
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