Lv3
278 积分 2023-06-06 加入
A study of failure mechanism in the formation of fine RDL patterns and Vias for heterogeneous packages in chip last fan-out panel level packaging
13天前
已完结
2.5D MCM (Multi-chip Module) Technology Development for Advanced Package
13天前
已完结
Novel Photo Imageable Film for RDL Application
1个月前
已完结
Development of New Concept Photo Imageable Dielectric Materials for Next-Generation Advanced Packaging
1个月前
已完结
Development of Low Temperature Processable Polyimides for Organic Hybrid Bonding Applications
1个月前
已完结
Packaging Challenges and Solutions for Next Generation Low-Profile WLCSP
1个月前
已完结
Characterization of Warpage of Ultra-Low-K Dielectric Materials and Correlation with Modulus and Coefficient of Thermal Expansion
1个月前
已完结
Novel low loss polymer with high thermal resistance for advanced IC packaging
1个月前
已完结
How to Manipulate Warpage in Fan-out Wafer and Panel Level Packaging
1个月前
已完结
Bio-based Epoxy Composites Demonstrating High Temperature Breakdown Strength and Thermal Conductivity for High Voltage Insulation
1个月前
已完结
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