Lv01
0 积分 2024-04-10 加入
Thermal Atomic Layer Etching of Copper by Sequential Steps Involving Oxidation and Exposure to Hexafluoroacetylacetone
1小时前
待确认
Two-Step Cyclic Etching of Copper Thin Films Using Acetylacetone/O2 Gases
2小时前
已完结
Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching
2小时前
已完结
Programmed alternating current optimization of Cu-catalyzed C-H bond transformations
4个月前
已完结
The effect of quaternary ammonium salts with different chain lengths on copper filling behavior in blind holes of printed circuit board
4个月前
已完结
Multi-Resonance Thermally Activated Delayed Fluorescence Molecules with Intramolecular-lock: Theoretical Design and Performance Prediction
7个月前
已完结
Restriction of Intramolecular Bending (RIB) Enables the Quantitative Design of AIEgens
7个月前
已完结
High‐Brightness, Hundred‐Second Level Ultralong Afterglow Polymers Built via Ultrasound‐Synchronized B‐O‐Click Strategy
7个月前
已完结
Hot‐pressing Metal Covalent Organic Frameworks as Personal Protection Films
7个月前
已完结
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