Lv11
10 积分 2024-05-29 加入
The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP)
14小时前
待确认
Hybrid CO2 laser-polishing process for improving material removal of silicon carbide
6天前
已完结
Ultrashort pulse laser slicing of semiconductor crystal
7天前
已完结
Super stealth dicing of transparent solids with nanometric precision
2个月前
已完结
Ultrashort Pulse Laser Lift-Off Processing of InGaN/GaN Light-Emitting Diode Chips
3个月前
已完结
Laser Lift‐Off Technologies for Ultra‐Thin Emerging Electronics: Mechanisms, Applications, and Progress
3个月前
已完结
Low‐Energy UV Ultrafast Laser Controlled Lift‐Off for High‐Quality Flexible GaN‐Based Device
3个月前
已完结
Deformation mechanism of gallium nitride in nanometric cutting
3个月前
已完结
Fabrication of Silicon Carbide Color Center Nanoparticles by Femtosecond Laser Ablation in Liquid
4个月前
已完结
GaN-based light-emitting diodes prepared with shifted laser stealth dicing
5个月前
已完结
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