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70 积分 2025-11-20 加入
Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO2, and Polyimide at 150°C and Atmospheric Pressure
8天前
已完结
SoIC for Low-Temperature, Multi-Layer 3D Memory Integration
8天前
已完结
Metallurgy - Advances in Materials and Processes
9天前
已关闭
Development of multi-stack dielectric wafer bonding
12天前
已完结
Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics
12天前
已完结
Low temperature direct bonding mechanisms of tetraethyl orthosilicate based silicon oxide films deposited by plasma enhanced chemical vapor deposition
13天前
已完结
The Role of Surface Chemistry in Bonding of Standard Silicon Wafers
13天前
已完结
Investigations on hardness of rf sputter deposited SiCN thin films
13天前
已完结
Thermal diffusivity in amorphous silicon carbon nitride thin films by the traveling wave technique
13天前
已完结
Enhancing Structural/Interfacial Stability and Li+ Diffusion Kinetics of LiCoO2 at High Voltage via a Synergetic Strategy
15天前
已完结
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