Lv4
620 积分 2023-01-04 加入
Signal Integrity Design and Analysis of a Spiral Through-Silicon Via (TSV) Array Channel for High Bandwidth Memory (HBM)
4天前
已完结
A Reflection and Crosstalk Canceling Continuous-Time Linear Equalizer for High-Speed DDR SDRAM
13天前
已完结
1.1 Innovation For the Next Decade of Compute Efficiency
13天前
已完结
Samsung PIM/PNM for Transfmer Based AI : Energy Efficiency on PIM/PNM Cluster
13天前
已完结
An FPGA-based RNN-T Inference Accelerator with PIM-HBM
13天前
已完结
Hardware Architecture and Software Stack for PIM Based on Commercial DRAM Technology : Industrial Product
13天前
已完结
25.4 A 20nm 6GB Function-In-Memory DRAM, Based on HBM2 with a 1.2TFLOPS Programmable Computing Unit Using Bank-Level Parallelism, for Machine Learning Applications
13天前
已完结
Fine Pitch and Low Temperature Nanocrystalline-Nanotwinned Cu and SiCN-to-SiO2 Wafer-to-Wafer Hybrid Bonding
27天前
已完结
Low Thermal Budget Growth of Near‐Isotropic Diamond Grains for Heat Spreading in Semiconductor Devices
3个月前
已完结
Dynamic phase change materials with extended surfaces
5个月前
已完结
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