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40 积分 2025-08-04 加入
Grain growth in electroplated (111)-oriented nanotwinned Cu
5天前
已完结
The rates of oxidation of several faces of a single crystal of copper as determined with elliptically polarized light
6天前
已完结
Study on the interfacial IMCs growth of nt-Cu/In solder joints
9天前
已关闭
Tensile Fracture Behavior of Sn-3.0Ag-0.5Cu Solder Joints on Copper
10天前
已完结
Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu
10天前
已完结
On the effect of Kirkendall voids on solder joint reliability
10天前
已完结
Thermal-Mechanical Behavior of Highly (111)-Oriented Nano Twinned Electroplated Copper for Advanced Electronic Packaging
11天前
已完结
Anomalous vertical twins with high (2 2 0) texture in direct current electroplating copper film
11天前
已完结
Investigation of the Stability of CuIn2 in Cu-In Phase Diagram
17天前
已完结
Abnormal Cu3Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates
19天前
已完结
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