Lv1
40 积分 2025-06-18 加入
Pressureless sinter-joining of copper pastes below 200 °C via multi-solvent collaborative engineering
3个月前
已完结
A Novel High-Performance, High-Power Double-Sided Cooling SiC Power Module Based on Low-Temperature Pressureless Nano-Cu Sintering
3个月前
已完结
Preparation of High Shear Strength Self‐Reduced Nanocopper Paste and Fracture Behavior Study of Sintering Joint
3个月前
已完结