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32 积分 2024-07-20 加入
The effects of polyamic acid on curing behavior, thermal stability, and mechanical properties of epoxy/DDS system
1天前
待确认
Thermal and Mechanical Characterization of Epoxy/Polyimide Blends via Postcuring Process
3天前
已完结
Enhanced Performance of Epoxy Resin-Polyimide Hybrid Composites with Aminated Carbon Nanofibers Filler
3天前
已完结
A polar polyimide as multifunctional flame retardant for epoxy resin through constructing intimate 3D interpenetrating polymer network
3天前
已完结
Rigid and crosslinkable polyimide curing epoxy resin with enhanced comprehensive performances
3天前
已完结
Dual covalent bond induced high thermally conductive polyimide composite films based on CNT@CN complex filler
5天前
已完结
Highly Thermally Conductive Polyimide Composite Films with Excellent Thermal and Electrical Insulating Properties
6天前
已完结
Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management
14天前
已完结
Light-induced step-growth polymerization
26天前
已完结
Bridging solvent-free polyamic acid and epoxy resin by Si-O-C hyperbranched polymer for enhanced compatibility, toughness and self-lubrication performance
1个月前
已完结
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