Lv3
220 积分 2024-02-28 加入
High-Adhesion Epoxy-Based Solder Resist Dry Film for Integrated Circuits Enhanced by 2,2-Bis(hydroxymethyl)propionic Acid
1个月前
已完结
Enhancing Dry Adhesion of Polymeric Micropatterns by Electric Fields
1个月前
已完结
Chemical Treatment of Sn‐Containing Transparent Conducting Oxides for the Enhanced Adhesion and Thermal Stability of Electroplated Metals
1个月前
已完结
Theoretical and experimental studies of mirror-bright Au coatings deposited from a novel cyanide-free thiosulphate-based electroplating bath
2个月前
已完结
Electroplating of gold from a solution containing tri-ammonium citrate and sodium sulphite
2个月前
已完结
Pulsed Galvanostatic Electrodeposition of Copper on Cobalt Using a pH-Neutral Plating Bath and Electroless Seeds
2个月前
已完结
DMH and NA–based cyanide-free silver electroplating bath: a promising alternative to cyanide ones in microelectronics
2个月前
已完结
New Cyanide-Free Ammonia Bath for Brass Alloy Coatings on Steel Substrate by Electrodeposition
2个月前
已完结
Logistic regression tree applied to classify PCB golden finger defects
2个月前
已完结
Insight into the mechanism of hydrogen permeation inhibition by cerium during electroplating: Enhanced kinetics of hydrogen desorption
3个月前
已完结
皖公网安备34019202002308
